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Job Description: ESSENTIAL DUTIES AND RESPONSIBILITIES: Develops and leads SiP (System in Package) assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Leads new package and SMT/Flip Chip/Underfill process qualification programs. Develops and maintain process documentation, including standard operating procedures and work instructions. Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp. 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Job Description: Role Summary Own the end-to-end PCIe system design for an NVMe SSD product line across client laptops and enterprise servers, from PHY/MAC review through ASIC/SoC integration, PCIe SFR/register analysis, and firmware design guidelines for robust link training, link transitions, low-power behavior. This role sits at the intersection of PCIe spec compliance, NVMe behavior, FW architecture, platform interoperability, and power/performance tuning. 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Job Description: We are hiring a Principal Engineer to serve as an architect for our Enterprise AI platform for engineering workflows. This role partners with the existing platform architect to set technical direction across Nexus's hybrid on-prem and cloud architecture, lead design for agentic systems, MCP ecosystem, LLM gateway, memory and knowledge layers, and ensure the platform scales securely and reliably as adoption grows across FPG. 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Description: Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. 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