{ "results": [ { "id": "c36b073ca393c59949aaa24803bbcfc0", "title": "Ingénieur Intelligence Artificielle Site", "employer_name": "GE Vernova", "employer_slug": "gevernova", "location_text": "Villeurbanne", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://gevernova.wd5.myworkdayjobs.com/Vernova_ExternalSite/job/Villeurbanne/Ingnieur-Intelligence-Artificielle-Site_R5034536-3", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Ingénieur Intelligence Artificielle Site Villeurbanne Job Description Summary Collaborer étroitement avec les différentes fonctions, équipes lean et parties prenantes pour identifier et évaluer de manière proactive les opportunités à fort", "parental_leave_weeks": 10, "non_birth_parent_leave_weeks": 10, "parental_leave_source_url": "https://www.gevernova.com/sustainability/documents/Sustainability/ge2022_sustainability_report_print_ada.pdf", "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 85, "benefit_verified": true, "benefit_last_verified": "2026-05-07", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "other", "employer_industry": "Industrial", "employer_size": "5000+", "quality_score": 55, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "masters", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "c2ce9cf9f281d99c818cd50b24a81c88", "title": "Manager - Competitive Intelligence (Obesity)", "employer_name": "Amgen", "employer_slug": "amgen", "location_text": "India - Hyderabad", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://amgen.wd1.myworkdayjobs.com/Careers/job/India---Hyderabad/Manager---Competitive-Intelligence--Obesity-_R-235656", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Manager - Competitive Intelligence (Obesity) India - Hyderabad Manager - Competitive Intelligence (Obesity) /job/India---Hyderabad/Manager---Competitive-Intelligence--Obesity-_R-235656 India - Hyderabad Posted 30+ Days Ago", "parental_leave_weeks": 6, "non_birth_parent_leave_weeks": 6, "parental_leave_source_url": "https://www.amgen.com/stories/2019/07/unique-benefits---family-leave-policy-provides-time-off-for-new-dads", "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 77, "benefit_verified": true, "benefit_last_verified": "2019-2024", "hire_states_allowed": [], "seniority": "senior", "years_experience_min": 5, "years_experience_max": 9, "role_function": "other", "employer_industry": "Healthcare", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "c23a736fc4c2a7fedd1e3ab1cc59e04e", "title": "Technical Lead – Cyber Intelligence Operations", "employer_name": "Leidos", "employer_slug": "leidos", "location_text": "Linthicum Heights, MD", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://leidos.wd5.myworkdayjobs.com/External/job/Linthicum-Heights-MD/Technical-Lead---Cyber-Intelligence-Operations_R-00178016", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Technical Lead – Cyber Intelligence Operations Linthicum Heights, MD Technical Lead – Cyber Intelligence Operations /job/Linthicum-Heights-MD/Technical-Lead---Cyber-Intelligence-Operations_R-00178016 Linthicum Heights, MD Posted 30+ Days Ago", "parental_leave_weeks": 4, "non_birth_parent_leave_weeks": 4, "parental_leave_source_url": "https://www.leidos.com/careers/pay-benefits", "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 73, "benefit_verified": true, "benefit_last_verified": "2026-05-07", "hire_states_allowed": [], "seniority": "senior", "years_experience_min": 5, "years_experience_max": 9, "role_function": "operations", "employer_industry": "Defense", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "c09412b0912b8fa2e5acc3dd773d89ca", "title": "Graduate Talent (Memory Design)", "employer_name": "Intel", "employer_slug": "intel", "location_text": "Malaysia, Penang", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/Malaysia-Penang/Graduate-Talent--Memory-Design-_JR0281471", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Graduate Talent (Memory Design) Malaysia, Penang Graduate Talent (Memory Design) /job/Malaysia-Penang/Graduate-Talent--Memory-Design-_JR0281471 Malaysia, Penang Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "design", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": 4, "roll_up_total_locations": 1 }, { "id": "bffaf66b27359ed692fa0fea2f805cea", "title": "Senior Wet Etch Manufacturing Development Engineer", "employer_name": "Intel", "employer_slug": "intel", "location_text": "2 Locations", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/US-Oregon-Hillsboro/Senior-Wet-Etch-Manufacturing-Development-Engineer_JR0282069-1", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Senior Wet Etch Manufacturing Development Engineer 2 Locations Senior Wet Etch Manufacturing Development Engineer /job/US-Oregon-Hillsboro/Senior-Wet-Etch-Manufacturing-Development-Engineer_JR0282069-1 2 Locations Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "senior", "years_experience_min": 5, "years_experience_max": 9, "role_function": "operations", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "bfa51ad5988a96eca7088cd263f73cee", "title": "Lad Engineering Technician- Temporary Position", "employer_name": "Intel", "employer_slug": "intel", "location_text": "Mexico, Guadalajara", "country": "US", "employment_type": "contract", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/Mexico-Guadalajara/Lad-Engineering-Technician--Temporary-Position_JR0281581", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Lad Engineering Technician- Temporary Position Mexico, Guadalajara Lad Engineering Technician- Temporary Position /job/Mexico-Guadalajara/Lad-Engineering-Technician--Temporary-Position_JR0281581 Mexico, Guadalajara Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "other", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "bf7c9b4bf223ffee409b6c0e1bc7e547", "title": "Systems Research Engineer/Scientist", "employer_name": "Intel", "employer_slug": "intel", "location_text": "US, Oregon, Hillsboro", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/US-Oregon-Hillsboro/Systems-Research-Engineer-Scientist_JR0282558", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Systems Research Engineer/Scientist US, Oregon, Hillsboro Systems Research Engineer/Scientist /job/US-Oregon-Hillsboro/Systems-Research-Engineer-Scientist_JR0282558 US, Oregon, Hillsboro Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "engineering", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "bf7b6aca568474084b40074309c7d489", "title": "Senior CPU Performance Architect", "employer_name": "Intel", "employer_slug": "intel", "location_text": "5 Locations", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/US-Texas-Austin/Senior-CPU-Performance-Architect_JR0282127", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Senior CPU Performance Architect 5 Locations Senior CPU Performance Architect /job/US-Texas-Austin/Senior-CPU-Performance-Architect_JR0282127 5 Locations Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "senior", "years_experience_min": 5, "years_experience_max": 9, "role_function": "other", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "bbb30d35d360eb287e1dc887f8407516", "title": "Director Government Affairs", "employer_name": "Intel", "employer_slug": "intel", "location_text": "US, Washington, D.C.", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/US-Washington-DC/Director-Goverment-Affairs_JR0277953-1", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Director Government Affairs US, Washington, D.C. Director Government Affairs /job/US-Washington-DC/Director-Goverment-Affairs_JR0277953-1 US, Washington, D.C. Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "staff_plus", "years_experience_min": 10, "years_experience_max": 15, "role_function": "other", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": 2, "roll_up_total_locations": 1 }, { "id": "bb7985e178c26580b6f005e7df8986d9", "title": "Counterintelligence (CI) Specialist - Senior", "employer_name": "Leidos", "employer_slug": "leidos", "location_text": "Fort Meade, MD", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://leidos.wd5.myworkdayjobs.com/External/job/Fort-Meade-MD/Counterintelligence--CI--Specialist---Senior_R-00174106", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Counterintelligence (CI) Specialist - Senior Fort Meade, MD Counterintelligence (CI) Specialist - Senior /job/Fort-Meade-MD/Counterintelligence--CI--Specialist---Senior_R-00174106 Fort Meade, MD Posted 30+ Days Ago", "parental_leave_weeks": 4, "non_birth_parent_leave_weeks": 4, "parental_leave_source_url": "https://www.leidos.com/careers/pay-benefits", "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 73, "benefit_verified": true, "benefit_last_verified": "2026-05-07", "hire_states_allowed": [], "seniority": "senior", "years_experience_min": 5, "years_experience_max": 9, "role_function": "operations", "employer_industry": "Defense", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "b8cfb58398648aab4cfa023cf5b064c6", "title": "Director of Data Science & Engineering", "employer_name": "Adobe Inc.", "employer_slug": "adobe", "location_text": "2 Locations", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://adobe.wd5.myworkdayjobs.com/external_experienced/job/San-Jose/Dir--Operational-Intelligence_R154930-1", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Director of Data Science & Engineering 2 Locations Director of Data Science & Engineering /job/San-Jose/Dir--Operational-Intelligence_R154930-1 2 Locations Posted 30+ Days Ago", "parental_leave_weeks": 16, "non_birth_parent_leave_weeks": 16, "parental_leave_source_url": "https://benefits.adobe.com/us/time-off/leaves-of-absence", "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 90, "benefit_verified": true, "benefit_last_verified": "2026-05-07", "hire_states_allowed": [], "seniority": "staff_plus", "years_experience_min": 10, "years_experience_max": 15, "role_function": "other", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "b847d9d55064bbccb7021d27ac9f9c09", "title": "Substrates Material Engineer", "employer_name": "Intel", "employer_slug": "intel", "location_text": "Virtual Philippines", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/Virtual-Philippines/Substrates-Material-Engineer_JR0281679", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Substrates Material Engineer Virtual Philippines Substrates Material Engineer /job/Virtual-Philippines/Substrates-Material-Engineer_JR0281679 Virtual Philippines Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "other", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "b6c51a36173a05bc0403e4cc9e343f1e", "title": "Stagiaire Ingénieur(e) modélisation et simulation de composants électroniques par intelligence artificielle", "employer_name": "GE Vernova", "employer_slug": "gevernova", "location_text": "Villeurbanne", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://gevernova.wd5.myworkdayjobs.com/Vernova_ExternalSite/job/Villeurbanne/Stagiaire-Ingnieur-e--modlisation-et-simulation-de-composants-lectroniques-par-intelligence-artificielle_R5009426-1", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Stagiaire Ingénieur(e) modélisation et simulation de composants électroniques par intelligence artificielle Villeurbanne Job Description Summary GE Vernova est une société mondiale du secteur de l’énergie s'appuyant sur plus de 130", "parental_leave_weeks": 10, "non_birth_parent_leave_weeks": 10, "parental_leave_source_url": "https://www.gevernova.com/sustainability/documents/Sustainability/ge2022_sustainability_report_print_ada.pdf", "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 85, "benefit_verified": true, "benefit_last_verified": "2026-05-07", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "other", "employer_industry": "Industrial", "employer_size": "5000+", "quality_score": 55, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "b5a5d0fb64077568b4e37db780a941a7", "title": "Power and Performance Architect", "employer_name": "Intel", "employer_slug": "intel", "location_text": "2 Locations", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/US-Oregon-Hillsboro/Power-and-Performance-Architect_JR0281948", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Power and Performance Architect 2 Locations Power and Performance Architect /job/US-Oregon-Hillsboro/Power-and-Performance-Architect_JR0281948 2 Locations Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "other", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "b3e2709ef3622e2925bd9b4ab9fb4df5", "title": "Advanced Packaging Materials Supply Chain Engineer", "employer_name": "Intel", "employer_slug": "intel", "location_text": "Japan, Tokyo", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/Japan-Tokyo/Advanced-Packaging-Materials-Supply-Chain-Engineer_JR0282046", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Advanced Packaging Materials Supply Chain Engineer Japan, Tokyo Advanced Packaging Materials Supply Chain Engineer /job/Japan-Tokyo/Advanced-Packaging-Materials-Supply-Chain-Engineer_JR0282046 Japan, Tokyo Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "operations", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "b26f0d80055e0c7f952ab9dc1d16f55d", "title": "Senior Design Verification Engineer- Mixed Signal IP", "employer_name": "Intel", "employer_slug": "intel", "location_text": "2 Locations", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/US-California-Folsom/Senior-Design-Verification-Engineer--Mixed-Signal-IP_JR0282396", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Senior Design Verification Engineer- Mixed Signal IP 2 Locations Senior Design Verification Engineer- Mixed Signal IP /job/US-California-Folsom/Senior-Design-Verification-Engineer--Mixed-Signal-IP_JR0282396 2 Locations Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "senior", "years_experience_min": 5, "years_experience_max": 9, "role_function": "design", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "ae8af7c2b7ac47bf6a1134c9468e2414", "title": "Packaging Module Equipment Development Engineer", "employer_name": "Intel", "employer_slug": "intel", "location_text": "US, Arizona, Phoenix", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/US-Arizona-Phoenix/Packaging-Module-Equipment-Development-Engineer_JR0282101", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Packaging Module Equipment Development Engineer US, Arizona, Phoenix Packaging Module Equipment Development Engineer /job/US-Arizona-Phoenix/Packaging-Module-Equipment-Development-Engineer_JR0282101 US, Arizona, Phoenix Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "engineering", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "ad6abbc120f4ed613acdb2f6bb87440d", "title": "AMHS Automation Systems Software Engineer", "employer_name": "Intel", "employer_slug": "intel", "location_text": "2 Locations", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/US-Oregon-Hillsboro/AMHS-Automation-Systems-Software-Engineer_JR0282488-1", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "AMHS Automation Systems Software Engineer 2 Locations AMHS Automation Systems Software Engineer /job/US-Oregon-Hillsboro/AMHS-Automation-Systems-Software-Engineer_JR0282488-1 2 Locations Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "engineering", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "ad4c1e06ddb8010c95ddf03dc18e21da", "title": "Sales Representative II - Endo Mechanical Intelligent Device - Surat", "employer_name": "Medtronic", "employer_slug": "medtronic", "location_text": "Surat, Gujarat, India", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://medtronic.wd1.myworkdayjobs.com/medtroniccareers/job/Surat-Gujarat-India/Sales-Representative-II---EMID_R61954-1", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Sales Representative II - Endo Mechanical Intelligent Device - Surat Surat, Gujarat, India Sales Representative II - Endo Mechanical Intelligent Device - Surat /job/Surat-Gujarat-India/Sales-Representative-II---EMID_R61954-1 Surat, Gujarat, India Posted 30+ Days", "parental_leave_weeks": 24, "non_birth_parent_leave_weeks": null, "parental_leave_source_url": "https://news.medtronic.com/9-benefits-Medtronic-offers-to-support-you-and-your-loved-ones-newsroom", "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 65, "benefit_verified": true, "benefit_last_verified": "2026-05-07", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "sales", "employer_industry": "Healthcare", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "ac43b0e505b26b008a7fb3913e5f2c79", "title": "Senior Business Intelligence Analyst, Pricing", "employer_name": "Home Depot (The)", "employer_slug": "homedepot", "location_text": "STORE SUPPORT CENTER, ATLANTA - 9090", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://homedepot.wd5.myworkdayjobs.com/CareerDepot/job/STORE-SUPPORT-CENTER-ATLANTA---9090/Senior-Business-Intelligence-Analyst--Pricing_Req162661", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Senior Business Intelligence Analyst, Pricing STORE SUPPORT CENTER, ATLANTA - 9090 Senior Business Intelligence Analyst, Pricing /job/STORE-SUPPORT-CENTER-ATLANTA---9090/Senior-Business-Intelligence-Analyst--Pricing_Req162661 STORE SUPPORT CENTER, ATLANTA - 9090 Posted 30+ Days Ago", "parental_leave_weeks": 6, "non_birth_parent_leave_weeks": 6, "parental_leave_source_url": "https://corporate.homedepot.com/news/culture/paid-parental-leave-dads-share-why-having-bonding-time-their-newborns-beneficial-boost", "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 77, "benefit_verified": true, "benefit_last_verified": "2026-05-07", "hire_states_allowed": [], "seniority": "senior", "years_experience_min": 5, "years_experience_max": 9, "role_function": "data", "employer_industry": "Retail", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "ac40f6c95d3b5d01504bcaa4d6ae08f9", "title": "Undergraduate Intern Technical", "employer_name": "Intel", "employer_slug": "intel", "location_text": "Malaysia, Kulim", "country": "US", "employment_type": "internship", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/Malaysia-Kulim/Undergraduate-Intern-Technical_JR0282330", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Undergraduate Intern Technical Malaysia, Kulim Undergraduate Intern Technical /job/Malaysia-Kulim/Undergraduate-Intern-Technical_JR0282330 Malaysia, Kulim Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "entry", "years_experience_min": 0, "years_experience_max": 4, "role_function": "other", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "aa5f7613554cfbe670d3be37c22293f0", "title": "CPU Physical Design Automation Engineer", "employer_name": "Intel", "employer_slug": "intel", "location_text": "US, Texas, Austin", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/US-Texas-Austin/CPU-Physical-Design-Automation-Engineer_JR0279671", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "CPU Physical Design Automation Engineer US, Texas, Austin CPU Physical Design Automation Engineer /job/US-Texas-Austin/CPU-Physical-Design-Automation-Engineer_JR0279671 US, Texas, Austin Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "design", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "aa26105bdb88cb4723bbe2fb13594441", "title": "AI Framework Engineering", "employer_name": "Intel", "employer_slug": "intel", "location_text": "PRC, Shanghai", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/PRC-Shanghai/AI-framework-Engineering_JR0282388-1", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "AI Framework Engineering PRC, Shanghai AI Framework Engineering /job/PRC-Shanghai/AI-framework-Engineering_JR0282388-1 PRC, Shanghai Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "other", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null }, { "id": "a95ee839364e01c67226b49b8d48933c", "title": "Network Systems and Solutions Engineer", "employer_name": "Intel", "employer_slug": "intel", "location_text": "Taiwan, Taipei", "country": "US", "employment_type": "full_time", "remote_status": "onsite", "days_in_office": 5, "timezone_overlap_hours": 6, "salary_min": null, "salary_max": null, "salary_currency": "USD", "salary_type": "unknown", "salary_period": null, "base_salary_min": null, "base_salary_max": null, "salary_disclosed": false, "equity_included": false, "equity_type": [ "none" ], "k401_match": null, "match_401k_pct": null, "profit_sharing": false, "bonus_offered": false, "top_startup_sources": [], "posted_at": "2026-04-05T00:00:00.000Z", "apply_url": "https://intel.wd1.myworkdayjobs.com/External/job/Taiwan-Taipei/Network-Systems-and-Solutions-Engineer_JR0281554", "apply_url_verified": false, "ats": "workday", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "Network Systems and Solutions Engineer Taiwan, Taipei Network Systems and Solutions Engineer /job/Taiwan-Taipei/Network-Systems-and-Solutions-Engineer_JR0281554 Taiwan, Taipei Posted 30+ Days Ago", "parental_leave_weeks": 12, "non_birth_parent_leave_weeks": 12, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 89, "benefit_verified": true, "benefit_last_verified": "unknown", "hire_states_allowed": [], "seniority": "mid", "years_experience_min": 3, "years_experience_max": 7, "role_function": "sales", "employer_industry": "Technology", "employer_size": "5000+", "quality_score": 45, "travel_pct": null, "requires_shift": null, "contractor_w2": "unknown", "required_timezone": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": 2, "roll_up_total_locations": 2 } ], "total": 2204, "page": 46, "per_page": 24, "applied_filters": { "q": "Intel", "quality_floor": "default", "match_401k_strict": false, "parental_strict": false, "non_birth_strict": false, "pto_strict": false, "include_older": false, "page": 46, "per_page": 24, "sort": "relevance" }, "hidden_unknown_benefits_count": 0, "hidden_quality_floor_count": 0, "quality_floor": "default" }