I'm looking for a job. I exported this list from FewerJobs.com - a curated job board.

Please:
1. Rank these jobs by fit for me, given my resume / skills.
2. Highlight the top 5 with a one-sentence rationale each.
3. Flag any concerns, including benefit values without source-backed evidence.
4. Suggest one or two filter changes I could make on FewerJobs to find more good matches.

Filters I applied:
- q: Intertek
- quality_floor: default
- match_401k_strict: true
- parental_strict: true
- non_birth_strict: true
- pto_strict: true
- include_older: false
- apply_url_verified: false
- page: 6
- per_page: 100
- sort: relevance

Jobs (100 total):

---
TITLE: Intern - Technician- Digital Automation and Solutions Team
EMPLOYER: Micron Technology, Inc.
LOCATION: Fab 10N/X, Singapore (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-10
K401_MATCH: yes (not source-backed)
APPLY_URL: https://micron.wd1.myworkdayjobs.com/External/job/Fab-10NX-Singapore/Intern---Digital-Automation-and-Solutions-Team_JR102616
EXCERPT: Intern - Technician- Digital Automation and Solutions Team Fab 10N/X, Singapore posted: Posted 2 Days Ago
---
TITLE: Senior Staff Embedded Developer (f/m/div)
EMPLOYER: Infineon Technologies
LOCATION: Lviv (Ukraine) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808967034008
EXCERPT: Senior Staff Embedded Developer (f/m/div) Lviv (Ukraine)
---
TITLE: Electrical Engineer for Facility Management
EMPLOYER: Infineon Technologies
LOCATION: Cegléd (Hungary) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970401976
EXCERPT: Electrical Engineer for Facility Management Cegléd (Hungary)
---
TITLE: Senior ASIC Design Engineer - Hardware
EMPLOYER: NVIDIA Corporation
LOCATION: US, TX, Austin (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://nvidia.wd5.myworkdayjobs.com/NVIDIAExternalCareerSite/job/US-TX-Austin/Senior-ASIC-Design-Engineer---Hardware_JR2008535
EXCERPT: Senior ASIC Design Engineer - Hardware US, TX, Austin posted: Posted Today
---
TITLE: Engineer Digital Functional Verification
EMPLOYER: Infineon Technologies
LOCATION: Hanoi (Vietnam) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970512527
EXCERPT: Engineer Digital Functional Verification Hanoi (Vietnam)
---
TITLE: Praktikant IoT Innovation als Hardware- und embedded Softwareingenieur (m/w/d) in Düsseldorf
EMPLOYER: Vodafone Group
LOCATION: Düsseldorf, Germany (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://vodafone.eightfold.ai/careers/job/563018681226971
EXCERPT: Praktikant IoT Innovation als Hardware- und embedded Softwareingenieur (m/w/d) in Düsseldorf Düsseldorf, Germany
---
TITLE: ASIC DFT DV Technical Leader
EMPLOYER: ThousandEyes
LOCATION: Armenia, Armenia (unspecified)
SALARY: Not disclosed
POSTED: 2026-02-11
APPLY_URL: https://cisco.wd5.myworkdayjobs.com/Cisco_Careers/job/Armenia/ASIC-DFT-DV-Technical-Leader_2006867/apply
EXCERPT: ASIC DFT DV Technical Leader Armenia, Armenia Join our team as an ASIC DFT DV Technical Leader, where you will drive innovation in hardware DFT strategies and enhance product quality. Collaborate with cross-functional teams to develop comprehensive test benches and mentor junior engineers. If you have a passion for solving complex challenges in silicon design, we want to hear from you!
---
TITLE: Duales Studium 2026: Informatik oder Technische Informatik (w/m/div) (Technische Hochschule Augsburg)
EMPLOYER: Infineon Technologies
LOCATION: Augsburg (Germany) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808961229298
EXCERPT: Duales Studium 2026: Informatik oder Technische Informatik (w/m/div) (Technische Hochschule Augsburg) Augsburg (Germany)
---
TITLE: FPGA Design Engineer
EMPLOYER: Northrop Grumman Corporation
LOCATION: United States-Illinois-Rolling Meadows (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://ngc.eightfold.ai/careers/job/1340071236135
EXCERPT: FPGA Design Engineer United States-Illinois-Rolling Meadows
---
TITLE: Account Executive, MidMarket - German Speaking
EMPLOYER: Intercom
LOCATION: Dublin, Ireland; London, England (unspecified)
SALARY: Not disclosed
POSTED: 2025-11-10
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/7386163
EXCERPT: Account Executive, MidMarket - German Speaking Dublin, Ireland; London, England Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? As a Mid-Market Account Executive, you will be a key member of the team leading the growth of our new business. We're building a world-class sales organization, and the road ahead is going to be very exciting. At Fin, we are striving to do sales differently. We are asking our customers to put Fin at the core of their businesses, and we can only do this by putting them at the core of ours. We strongly believe in the overall growth and
---
TITLE: Senior GTM Enablement Manager, Operations
EMPLOYER: Intercom
LOCATION: San Francisco, California (unspecified)
SALARY: $150K-$188K
POSTED: 2025-12-10
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/7441053
EXCERPT: Senior GTM Enablement Manager, Operations San Francisco, California Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? Intercom's Global Sales Organization is rapidly evolving, and the GTM Enablement team is expanding to support. Our mission is to empower Intercom's GTM teams by providing the systems, processes, and strategic insights that drive maximum productivity and operational excellence. As the Senior GTM Enablement Manager, Operations , you will be the critical link between our sales team and the cross-functional GTM partners (like Revenue Operations, Monetization, Legal, and Systems) who create the policies, tooling, and procedures that impact them. Your role is to ensure
---
TITLE: Gruppenpraktikum im Bereich Kaufleute für Büromanagement (w/m/d)* - Juli 2026
EMPLOYER: Infineon Technologies
LOCATION: Munich (Germany) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808968006425
EXCERPT: Gruppenpraktikum im Bereich Kaufleute für Büromanagement (w/m/d)* - Juli 2026 Munich (Germany)
---
TITLE: Hardware Engineer
EMPLOYER: Arrow Electronics
LOCATION: Benton Harbor, Michigan, United States of America (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-10
K401_MATCH: yes (not source-backed)
APPLY_URL: https://arrow.wd1.myworkdayjobs.com/AC/job/Benton-Harbor-Michigan/Device-Engineer_R242718/apply
EXCERPT: Hardware Engineer Benton Harbor, Michigan, United States of America Join our team as a Senior Hardware Engineer and drive the next-gen HMI module architecture for leading-edge electronics. Collaborate with top-tier partners, design high-performance boards, and ensure certification and field testing. Shape innovative solutions in a dynamic, growth-focused environment. Ready to make an impact? Apply now to advance your engineering career!
---
TITLE: Intern - Probe Automation
EMPLOYER: Micron Technology, Inc.
LOCATION: Fab 10N/X, Singapore (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://micron.wd1.myworkdayjobs.com/External/job/Fab-10NX-Singapore/Intern---Probe-Automation_JR101198
EXCERPT: Intern - Probe Automation Fab 10N/X, Singapore posted: Posted 30+ Days Ago
---
TITLE: Senior Customer Success Enablement Manager
EMPLOYER: Intercom
LOCATION: San Francisco, California (unspecified)
SALARY: $167K-$199K
POSTED: 2026-06-08
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/7973740
EXCERPT: Senior Customer Success Enablement Manager San Francisco, California Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? Intercom's Customer Success organization is scaling to meet the demands of a growing book of business and an increasingly complex customer landscape. We're seeking a Senior Customer Success Enablement Manager based in San Francisco to serve as a strategic business partner to our Customer Success leadership team. This role blends execution and strategic advisory. You'll build and ship enablement programs end-to-end, and you'll partner with senior leaders to shape direction, drive decisions, and bring a clear point of view to every stakeholder conversation. The
---
TITLE: ASIC Engineering Digital Design Leader ( digital design, FSM, CPU sub-systems, complex SOCs, FPGA validation | 12-16 Years | Pune)
EMPLOYER: ThousandEyes
LOCATION: Pune, India (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-21
APPLY_URL: https://cisco.wd5.myworkdayjobs.com/Cisco_Careers/job/Pune-India/ASIC-Engineering-Digital-Design-Leader---digital-design--FSM--CPU-sub-systems--complex-SOCs--FPGA-validation---12-16-Years---Pune-_2013153-1/apply
EXCERPT: ASIC Engineering Digital Design Leader ( digital design, FSM, CPU sub-systems, complex SOCs, FPGA validation | 12-16 Years | Pune) Pune, India Exciting opportunity for a Digital Design Lead to drive the development of advanced digital logic for high-speed optical interconnects at Cisco. Lead technical strategy, manage ASIC/SoC design, and collaborate with cross-functional teams to deliver cutting-edge solutions for next-generation data center networking. Join us to shape the future of optical technology.
---
TITLE: Design Engineer
EMPLOYER: Smiths Group
LOCATION: Dundee, , United Kingdom (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-10
APPLY_URL: https://jobs.smartrecruiters.com/SmithsGroup2/744000118484587-design-engineer
EXCERPT: Design Engineer Dundee, , United Kingdom Company Description: Smiths Interconnect, is a global leader in the design and manufacture of high-performance interconnect solutions. Our products are used in mission-critical applications across industries such as aerospace, defense, telecommunications, and industrial markets. At Smiths Interconnect, we are committed to innovation, quality, and providing cutting-edge solutions that connect the world's most demanding systems. Smiths Interconnect is part of Smiths Group. For over 170 years, Smiths has been pioneering progress by engineering for a better future. We serve millions of people every year, to help create a safer, more efficient and productive, and better-connected world across four global markets: energy, security & defense, space & aerospace and general industrial. Listed on the London Stock Exchange, Smiths employs c.16,000 colleagues in over 50 countries. Job Description: Create detailed cable, connector, and contact designs on 3D or 2D CAD system. Technical lead for the development of interconnect solutions including design of the following: contacts, insulators, cabling and latching mechanisms Support Senior Design Engineer for development of complex interconnect solutions Coordinate the construction of functional and non-functional prototypes with internal and external vendors Lead/support group design reviews using calculations, experimental results or research Technical lead during the new product introduction process, including assisting manufacturing with tooling adjustments Provide technical support for existing products Apply principles of electrical engineering as they pertain to connectors, contact technology and cable design Generate test procedures and test and/or oversee testing of new designs as necessary Perform risk analysis such as FMEA
---
TITLE: Analog and Mixed-Signal IC Design Engineer Intern
EMPLOYER: Neuralink
LOCATION: South San Francisco, California, United States (unspecified)
SALARY: Not disclosed
POSTED: 2026-02-18
K401_MATCH: yes (not source-backed)
APPLY_URL: https://boards.greenhouse.io/neuralink/jobs/7565469003?gh_jid=7565469003
EXCERPT: Analog and Mixed-Signal IC Design Engineer Intern South San Francisco, California, United States About Neuralink: We are creating devices that enable a bi-directional interface with the brain. These devices allow us to restore movement to the paralyzed, restore sight to the blind, and revolutionize how humans interact with their digital world. Team Description: The Brain Interfaces Soc Department delivers chip architecture and silicon implementation of neural recording and stimulation system-on-chip (SoC) for high-bandwidth brain-machine interface applications. We have crafted a team of exceptional engineers whose mission is to push the frontiers of what is possible today and define the future. To accelerate our pathway to human ready brain-computer interfaces, you will have the opportunity to partner with our electrical, microfabrication, chip designers, neuro and mechanical engineers. Job Responsibilities: We are looking for Analog and Mixed-Signal IC Design Engineer Interns who are interested in architecting and implementing innovative solutions with high energy-efficiency and compact silicon footprint and who thrive with the autonomy to propose creative approaches to problems. Neuralink strives to be, as much as possible, a meritocratic environment: we require honest and transparent communication to ensure the best ideas win out, and we believe the best solutions emerge and the best teams are created when you assemble high-performing individuals with different skill sets and perspectives, and allow them to engage in rigorous and thoughtful inquiry. We want to work with exceptional people, and, to the extent that you excel, we want you to take on more responsibility and help all
---
TITLE: IO Design Architect – High Speed Memory Interfaces (m/f/d)
EMPLOYER: Micron Technology, Inc.
LOCATION: Munich (MDC), Germany (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://micron.wd1.myworkdayjobs.com/External/job/Munich-MDC-Germany/IO-Design-Architect---High-Speed-Memory-Interfaces--m-f-d-_JR91514-1
EXCERPT: IO Design Architect – High Speed Memory Interfaces (m/f/d) Munich (MDC), Germany posted: Posted Today
---
TITLE: Manager, Account Executives (MidMarket)
EMPLOYER: Intercom
LOCATION: San Francisco, California (unspecified)
SALARY: $349K-$349K
POSTED: 2025-10-21
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/7345261
EXCERPT: Manager, Account Executives (MidMarket) San Francisco, California Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? The role will lead a team of Account Executives primarily responsible for new business revenue in the North America Region. This person will be responsible for segment strategy and planning, building, and running a high performing team. Goals are focused on accelerating logo and revenue growth with a concentration on Fin. We are looking for a highly effective leader who excels at attracting and developing talent, inspiring others, and working cross-functionally to build efficient and customer-centric sales processes. This leader will also play a critical
---
TITLE: Manager, Relationship Managers (SMB)
EMPLOYER: Intercom
LOCATION: Chicago, Illinois (unspecified)
SALARY: $248K-$296K
POSTED: 2026-02-05
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/7583181
EXCERPT: Manager, Relationship Managers (SMB) Chicago, Illinois Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? Fin is transforming how businesses build relationships with their customers by embedding AI deeply into our platform. As customers adopt AI-driven capabilities, they need trusted partners who can guide them through change, help them understand value, and ensure adoption translates into meaningful business outcomes. We're looking for a sales leader to build, scale, and evolve a team of Small Business / Scale Relationship Managers. This role is ideal for someone who excels at developing early-career sales talent, instilling strong sales rigor, and leading teams through periods
---
TITLE: Internship - Product Engineer
EMPLOYER: Infineon Technologies
LOCATION: Samut Prakan (Thailand) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970982872
EXCERPT: Internship - Product Engineer Samut Prakan (Thailand)
---
TITLE: Senior ASIC Design Engineer – Clocks IP
EMPLOYER: NVIDIA Corporation
LOCATION: 2 Locations (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-08
K401_MATCH: yes (not source-backed)
APPLY_URL: https://nvidia.wd5.myworkdayjobs.com/NVIDIAExternalCareerSite/job/US-CA-Santa-Clara/Senior-ASIC-Design-Engineer---Clocks-IP_JR2003480
EXCERPT: Senior ASIC Design Engineer – Clocks IP 2 Locations posted: Posted 4 Days Ago
---
TITLE: Intercompany Specialist
EMPLOYER: Deutsche Post
LOCATION: Istanbul, Istanbul, Turkey (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-14
K401_MATCH: yes (not source-backed)
APPLY_URL: https://dpdhlgroup.avature.net/tr_TR/jobs/ApplicationMethods?jobId=353268&source=careers.dhl.com
EXCERPT: Intercompany Specialist Istanbul, Istanbul, Turkey We are searching for an Intercompany Specialist who will be part of the Record to Report - Intercompany (RTR-IC) Team and will directly report to the Accounting Team Leader. Key Tasks. Perform inte...
---
TITLE: Internship: IT (Software Development)
EMPLOYER: Infineon Technologies
LOCATION: Melaka (Malaysia) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970869753
EXCERPT: Internship: IT (Software Development) Melaka (Malaysia)
---
TITLE: Senior Staff Engineer Technology Integration
EMPLOYER: Infineon Technologies
LOCATION: Melaka (Malaysia) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808969329257
EXCERPT: Senior Staff Engineer Technology Integration Melaka (Malaysia)
---
TITLE: Technical Consultant System Integration & Support (m/w/d)
EMPLOYER: Deutsche Telekom AG
LOCATION: Köln, Germany (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
APPLY_URL: https://telekom-growthhub.eightfold.ai/careers/job/563465371790516
EXCERPT: Technical Consultant System Integration & Support (m/w/d) Köln, Germany
---
TITLE: Working Student (f/m/d) MCU Support
EMPLOYER: NXP Semiconductors
LOCATION: Munich (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-08
PARENTAL_LEAVE_WEEKS: 6 (not source-backed)
NON_BIRTH_PARENT_LEAVE_WEEKS: 6 (not source-backed)
K401_MATCH: yes (not source-backed)
APPLY_URL: https://nxp.wd3.myworkdayjobs.com/Careers/job/Munich/Working-Student--f-m-d--MCU-Support_R-10063859-1
EXCERPT: Working Student (f/m/d) MCU Support Munich posted: Posted 4 Days Ago
---
TITLE: Hardware Development Engineer
EMPLOYER: Rockwell Automation
LOCATION: Katowice, Poland (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
PARENTAL_LEAVE_WEEKS: 6 (not source-backed)
NON_BIRTH_PARENT_LEAVE_WEEKS: 6 (not source-backed)
K401_MATCH: yes (not source-backed)
APPLY_URL: https://rockwellautomation.wd1.myworkdayjobs.com/External_Rockwell_Automation/job/Katowice-Poland/Hardware-Development-Engineer_R26-1845
EXCERPT: Hardware Development Engineer Katowice, Poland posted: Posted 30+ Days Ago
---
TITLE: Senior Product Engineer, AI
EMPLOYER: Intercom
LOCATION: Dublin, Ireland; London, England (unspecified)
SALARY: Not disclosed
POSTED: 2024-09-27
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/6276021
EXCERPT: Senior Product Engineer, AI Dublin, Ireland; London, England Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? We're looking for Senior Product Engineers to join the AI Group to build Fin's AI-powered products. Product Engineers working in ML work closely with both our ML Scientists and product teams. They must deeply understand our product, our customers, our ML tech stack and our broader product stack. Our group is responsible for defining new ML features, researching appropriate algorithms and technologies, and rapidly getting first prototypes in our customers' hands. We are an extremely product focussed team. We work in partnership with Product
---
TITLE: Graduate - Analog Mixed-Signal Design Engineer
EMPLOYER: Infineon Technologies
LOCATION: El Segundo | CA (United States) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808971028587
EXCERPT: Graduate - Analog Mixed-Signal Design Engineer El Segundo | CA (United States)
---
TITLE: Senior Technician Reliability
EMPLOYER: Infineon Technologies
LOCATION: Penang (Malaysia) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808971164707
EXCERPT: Senior Technician Reliability Penang (Malaysia)
---
TITLE: Hardware Applications Engineer
EMPLOYER: Broadcom
LOCATION: Singapore-Yishun (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
APPLY_URL: https://broadcom.wd1.myworkdayjobs.com/External_Career/job/Singapore-Yishun/Hardware-Applications-Engineer_R025632
EXCERPT: Hardware Applications Engineer Singapore-Yishun posted: Posted 30+ Days Ago
---
TITLE: Staff Application Engineer- experienced in Power IC validation
EMPLOYER: Renesas Electronics
LOCATION: Taipei, , Taiwan (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-10
K401_MATCH: yes (not source-backed)
APPLY_URL: https://jobs.smartrecruiters.com/RenesasElectronics/744000127593565-staff-application-engineer-experienced-in-power-ic-validation
EXCERPT: Staff Application Engineer- experienced in Power IC validation Taipei, , Taiwan Company Description: Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world's leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what's next in electronics and the world. Job Description: Plan and execute product validation and characterization to demonstrate performance, robustness, and compliance to customer use-cases Collaborate with Product Engineering, R&D, Firmware, and Marketing to translate customer requirements into product features, configuration options, and roadmap feedback. Develop test plans, automate bench measurements where applicable (Python/C), analyze data, and generate
---
TITLE: Principal Interconnect Development Engineer
EMPLOYER: Hewlett Packard Enterprise
LOCATION: San Jose, California, United States of America (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-15
K401_MATCH: yes (not source-backed)
CHILDCARE_SUBSIDY: yes (not source-backed)
APPLY_URL: https://hpe.wd5.myworkdayjobs.com/Jobsathpe/job/San-Jose-California-United-States-of-America/Interconnect-Development-Engineer_1195285-3/apply
EXCERPT: Principal Interconnect Development Engineer San Jose, California, United States of America Exciting opportunity for a Principal Interconnect Development Engineer to lead high-speed interconnect solutions for next-generation network switches and routers. Drive innovation, influence industry standards, and collaborate with top-tier engineers. Shape the future of interconnect technology with a global leader in edge-to-cloud solutions. Join us and make a lasting impact!
---
TITLE: Intern – Auto Power Product Applications
EMPLOYER: Analog Devices
LOCATION: Italy, Milan, Assago (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
PARENTAL_LEAVE_WEEKS: 6 (not source-backed)
NON_BIRTH_PARENT_LEAVE_WEEKS: 6 (not source-backed)
K401_MATCH: yes (not source-backed)
APPLY_URL: https://analogdevices.wd1.myworkdayjobs.com/External/job/Italy-Milan-Assago/Intern---Auto-Power-Product-Applications_R257709
EXCERPT: Intern – Auto Power Product Applications Italy, Milan, Assago posted: Posted 30+ Days Ago
---
TITLE: Advanced CMOS Device & Process Integration Engineer
EMPLOYER: Micron Technology, Inc.
LOCATION: Hiroshima - Fab 15, Japan (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://micron.wd1.myworkdayjobs.com/External/job/Hiroshima---Fab-15-Japan/Advanced-CMOS-Device---Process-Integration-Engineer_JR88901
EXCERPT: Advanced CMOS Device & Process Integration Engineer Hiroshima - Fab 15, Japan posted: Posted 30+ Days Ago
---
TITLE: Senior Staff Engineer Wireless RF System (f/m/div)
EMPLOYER: Infineon Technologies
LOCATION: Villach (Austria) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970481196
EXCERPT: Senior Staff Engineer Wireless RF System (f/m/div) Villach (Austria)
---
TITLE: R&D Mechanical Engineer - International Aftermarket Services Team
EMPLOYER: Eaton Corporation
LOCATION: Sincan Ankara, TUR, 06930 | Ankara, Ankara, TR (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://eaton.eightfold.ai/careers/job/687235723161
EXCERPT: R&D Mechanical Engineer - International Aftermarket Services Team Sincan Ankara, TUR, 06930 | Ankara, Ankara, TR
---
TITLE: Digital Engineer Intern
EMPLOYER: Renesas Electronics
LOCATION: Lviv, , Ukraine (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-10
K401_MATCH: yes (not source-backed)
APPLY_URL: https://jobs.smartrecruiters.com/RenesasElectronics/744000107698600-digital-engineer-intern
EXCERPT: Digital Engineer Intern Lviv, , Ukraine Company Description: Job Description: We are looking for a highly motivated Intern/ Working Student who will join our team as an Intern Digital Engineer in Lviv office. The role: Design of basic digital circuits meeting performance and area. Simulation, verification, and lab evaluation of digital circuits. Demonstrates an ability to learn new tool features and procedures. Attend training courses. Build up your knowledge and improve your skills using your own research. Qualifications: University students at Electrical Engineering or related disciplines. Preferably university experience in design of analog/digital circuits. Knowledge of electrical properties, digital circuits, behavioral modeling and simulation and Unix. Understanding of HW design workflow. Ability to prioritize work, set goals and meet deadlines. Self-motivated and take full responsibility for solutions. Good written, communication and teamwork skills. Pre-intermediate English level. Will be a plus: Knowledge of transistor-level integrated circuits and semiconductor physics. Experience with protocols (UART, I2C, SPI, JTAG, etc.). Knowledge of PCB design, FPGA, Microcontrollers, Arduino. Programming/scripting (Verilog-A/AMS, TCL, Python, Bash, Perl, C/C++). Familiarity with Cadence IC design Tools (ex.: ADE, Spectre, Layout Suite), Calibre. Additional Information: Fixed-Term Contract - duration approx. 6 months. Friendly and highly professional team. 14 calendar days paid vacation. Flexible working hours. Professional & personal growth. Renesas is an embedded semiconductor solution provider driven by its Purpose ' To Make Our Lives Easier .' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions
---
TITLE: NPI Sourcing Engineer
EMPLOYER: Smiths Group
LOCATION: Suzhou, , China (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-10
APPLY_URL: https://jobs.smartrecruiters.com/SmithsGroup2/744000111554730-npi-sourcing-engineer
EXCERPT: NPI Sourcing Engineer Suzhou, , China Company Description: Smiths Interconnect, is a global leader in the design and manufacture of high-performance interconnect solutions. Our products are used in mission-critical applications across industries such as aerospace, defense, telecommunications, and industrial markets. At Smiths Interconnect, we are committed to innovation, quality, and providing cutting-edge solutions that connect the world's most demanding systems. Smiths Interconnect is part of Smiths Group. For over 170 years, Smiths has been pioneering progress by engineering for a better future. We serve millions of people every year, to help create a safer, more efficient and productive, and better-connected world across four global markets: energy, security & defense, space & aerospace and general industrial. Listed on the London Stock Exchange, Smiths employs c.16,000 colleagues in over 50 countries. Job Description: Responsibilities: Represent sourcing team as key drivers in NPI project for most suitable supplier base selection Drive NPI project for respective to successful completion on time and meeting project needs for cost, quality. Pull through supplier on current business when awarding NPI projects Partner with sourcing stakeholders, including offering Management to ensure appropriate sourcing measures and metrics are in place and deployed that measure progress against initiatives. Deliver KPI's and develop necessary corrective action plans if need Close communicate with engineering teams to align project expectations from sourcing Support Technology symposiums for Design Engineer Strong Cost improvement sensor and close work with Engineering and supplier for cost improvement opportunity deep dive and drive best cost for projects Maintain continuous
---
TITLE: Lead Principal Engineer Analog Mixed-Signal Design
EMPLOYER: Infineon Technologies
LOCATION: San Jose | CA (United States) | El Segundo | El Segundo, CA, USA (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808969357367
EXCERPT: Lead Principal Engineer Analog Mixed-Signal Design San Jose | CA (United States) | El Segundo | El Segundo, CA, USA
---
TITLE: Hardware Engineer
EMPLOYER: Magna International Inc.
LOCATION: Novi, Michigan, US (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://magna.wd3.myworkdayjobs.com/Magna/job/Novi-Michigan-US/Hardware-Engineer_R00238285
EXCERPT: Hardware Engineer Novi, Michigan, US posted: Posted 30+ Days Ago
---
TITLE: Senior FPGA/ASIC Design /Verification Engineer (Onsite)
EMPLOYER: Raytheon Technologies
LOCATION: US-IA-CEDAR RAPIDS-193 ~ 1120 Collins Rd NE ~ BLDG193 (onsite)
SALARY: Not disclosed
POSTED: 2026-05-12
PARENTAL_LEAVE_WEEKS: 4 (not source-backed)
NON_BIRTH_PARENT_LEAVE_WEEKS: 4 (not source-backed)
K401_MATCH: yes (not source-backed)
APPLY_URL: https://globalhr.wd5.myworkdayjobs.com/REC_RTX_Ext_Gateway/job/US-IA-CEDAR-RAPIDS-193--1120-Collins-Rd-NE--BLDG193/Senior-FPGA-ASIC-Design--Verification-Engineer--Onsite-_01840812
EXCERPT: Senior FPGA/ASIC Design /Verification Engineer (Onsite) US-IA-CEDAR RAPIDS-193 ~ 1120 Collins Rd NE ~ BLDG193 posted: Posted 30+ Days Ago
---
TITLE: Intern – Dry Etch Process and Equipment
EMPLOYER: Micron Technology, Inc.
LOCATION: Fab 10N/X, Singapore (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-20
K401_MATCH: yes (not source-backed)
APPLY_URL: https://micron.wd1.myworkdayjobs.com/External/job/Fab-10NX-Singapore/Intern---Dry-Etch-Process-and-Equipment_JR97668
EXCERPT: Intern – Dry Etch Process and Equipment Fab 10N/X, Singapore posted: Posted 23 Days Ago
---
TITLE: Forward Deployed Software Engineer
EMPLOYER: Intercom
LOCATION: Dublin, Ireland (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-04
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/7982566
EXCERPT: Forward Deployed Software Engineer Dublin, Ireland Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? Over the past twelve months, we've seen rapidly growing demand for Software Engineers who thrive at the intersection of deep technical work, customer impact, and product strategy. As Fin's AI Agent for Customer Service, Fin, becomes mission-critical for our most strategic customers, we're building a team of Forward Deployed Software Engineers to help bridge the gap between customer needs and product innovation. As a Forward Deployed Software Engineer, you'll work hands-on with some of Fin's most strategic customers, partnering closely with our R&D and Go-to-Market teams
---
TITLE: Intern- Backend Assembly Encapsulation Equipment
EMPLOYER: Micron Technology, Inc.
LOCATION: Muar, Malaysia (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://micron.wd1.myworkdayjobs.com/External/job/Muar-Malaysia/Intern--Backend-Assembly-Encapsulation-Equipment_JR99823
EXCERPT: Intern- Backend Assembly Encapsulation Equipment Muar, Malaysia posted: Posted 30+ Days Ago
---
TITLE: Internship: Autonomous Factory
EMPLOYER: Infineon Technologies
LOCATION: Melaka (Malaysia) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970827630
EXCERPT: Internship: Autonomous Factory Melaka (Malaysia)
---
TITLE: Principal Electrical Engineer - ASIC/FPGA (Onsite)
EMPLOYER: Raytheon Technologies
LOCATION: US-IA-CEDAR RAPIDS-166 ~ 855 35Th St NE ~ BLDG 166 (onsite)
SALARY: Not disclosed
POSTED: 2026-05-29
PARENTAL_LEAVE_WEEKS: 4 (not source-backed)
NON_BIRTH_PARENT_LEAVE_WEEKS: 4 (not source-backed)
K401_MATCH: yes (not source-backed)
APPLY_URL: https://globalhr.wd5.myworkdayjobs.com/REC_RTX_Ext_Gateway/job/US-IA-CEDAR-RAPIDS-166--855-35Th-St-NE--BLDG-166/Principal-Electrical-Engineer---ASIC-FPGA--Onsite-_01849071
EXCERPT: Principal Electrical Engineer - ASIC/FPGA (Onsite) US-IA-CEDAR RAPIDS-166 ~ 855 35Th St NE ~ BLDG 166 posted: Posted 14 Days Ago
---
TITLE: Senior Electrical Engineer – DSP ASIC/FPGA (Onsite)
EMPLOYER: Raytheon Technologies
LOCATION: US-IA-CEDAR RAPIDS-166 ~ 855 35Th St NE ~ BLDG 166 (onsite)
SALARY: Not disclosed
POSTED: 2026-05-29
PARENTAL_LEAVE_WEEKS: 4 (not source-backed)
NON_BIRTH_PARENT_LEAVE_WEEKS: 4 (not source-backed)
K401_MATCH: yes (not source-backed)
APPLY_URL: https://globalhr.wd5.myworkdayjobs.com/REC_RTX_Ext_Gateway/job/US-IA-CEDAR-RAPIDS-166--855-35Th-St-NE--BLDG-166/Senior-Electrical-Engineer---DSP-ASIC-FPGA--Onsite-_01849069
EXCERPT: Senior Electrical Engineer – DSP ASIC/FPGA (Onsite) US-IA-CEDAR RAPIDS-166 ~ 855 35Th St NE ~ BLDG 166 posted: Posted 14 Days Ago
---
TITLE: Quality Staff Specialist
EMPLOYER: Infineon Technologies
LOCATION: Cegléd (Hungary) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970671638
EXCERPT: Quality Staff Specialist Cegléd (Hungary)
---
TITLE: Hardware Architect
EMPLOYER: Aptiv
LOCATION: Bangalore, India (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://aptiv.wd5.myworkdayjobs.com/APTIV_CAREERS/job/Bangalore-India/Hardware-Architect_J000692931
EXCERPT: Hardware Architect Bangalore, India posted: Posted 30+ Days Ago
---
TITLE: Working Student - Technical Customer Documentation (f/m/d)
EMPLOYER: Infineon Technologies
LOCATION: Munich (Germany) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808971056329
EXCERPT: Working Student - Technical Customer Documentation (f/m/d) Munich (Germany)
---
TITLE: Leader of Analog, Mixed-Signal & RF IC Design
EMPLOYER: Maxlinear Inc
LOCATION: Irvine, CA, US; Carlsbad, CA, US (unspecified)
SALARY: $177K-$259K
POSTED: 2026-06-10
APPLY_URL: https://careersus-maxlinear.icims.com/jobs/3022/leader-of-analog,-mixed-signal-&-rf-ic-design/job
EXCERPT: Leader of Analog, Mixed-Signal & RF IC Design Irvine, CA, US; Carlsbad, CA, US Responsibilities We are seeking an exceptional Director / Senior Manager to lead our Analog, Mixed-Signal team. The team is responsible for developing IPs for data center SERDES applications for 200G and 400G, including DSPs, Drivers, and TIAs. This is a people management position with hands-on technical leadership responsibilities. In this role, you will focus on the following: Provide hands-on technical leadership, driving strategic decisions, roadmaps, and architectural developments for mixed-signal designs across global teams Partner with IC designers and system engineers to develop high-performance analog and mixed-signal circuits for next-generation products Translate product specifications into block-level design requirements and drive technical excellence in Implementation Build, mentor, and develop a world-class team of analog, mixed-signal, and RF IC designers Recruit top talent and cultivate a high-performance, innovative culture Drive performance management, career development, and succession planning Enhance organizational capability through coaching and skills development Partner with system engineering, digital design, CAD, and technology teams to optimize design flows and methodologies Collaborate with support teams to enhance productivity across the organization Interface with customers throughout product development and release-to-production phases Represent the design organization in executive-level technical and business discussions Oversee IC tape-out and
---
TITLE: Systems Engineer – Motor Control and Power Conversion
EMPLOYER: Infineon Technologies
LOCATION: Lviv (Ukraine) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970266736
EXCERPT: Systems Engineer – Motor Control and Power Conversion Lviv (Ukraine)
---
TITLE: Hardware Engineer
EMPLOYER: Novanta Inc
LOCATION: Brno (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://novanta.wd5.myworkdayjobs.com/Novanta-Careers/job/Brno/Hardware-Engineer_R008820
EXCERPT: Hardware Engineer Brno posted: Posted 30+ Days Ago
---
TITLE: Principal Subcon Engineering
EMPLOYER: Infineon Technologies
LOCATION: Taipei (Taiwan) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808969326601
EXCERPT: Principal Subcon Engineering Taipei (Taiwan)
---
TITLE: Account Manager - German Speaking
EMPLOYER: Intercom
LOCATION: Dublin, Ireland (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-11
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/7912544
EXCERPT: Account Manager - German Speaking Dublin, Ireland Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? As a German Speaking Account Manager (Mid-Market), you will be a key member of the team leading the growth of our existing book of business in EMEA including German speaking regions. We're building a world-class sales organization, and the road ahead is going to be very exciting. At Fin, we are focused on building long lasting relationships with our customers. We are asking customers to put Fin at the core of their businesses, and we can only do this by putting them at the core
---
TITLE: Production/Operations Intern (Manufacturing)
EMPLOYER: Eaton Corporation
LOCATION: Bosconero, Turin, ITA, 10080 (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://eaton.eightfold.ai/careers/job/687236708094
EXCERPT: Production/Operations Intern (Manufacturing) Bosconero, Turin, ITA, 10080
---
TITLE: Staff Engineer AMS Implementation (f/m/div)
EMPLOYER: Infineon Technologies
LOCATION: Munich (Germany) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970806235
EXCERPT: Staff Engineer AMS Implementation (f/m/div) Munich (Germany)
---
TITLE: Master Thesis: AI-based Analog/Mixed Signal Design (f/m/div)
EMPLOYER: Infineon Technologies
LOCATION: Padua (Padova) (Italy) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970762499
EXCERPT: Master Thesis: AI-based Analog/Mixed Signal Design (f/m/div) Padua (Padova) (Italy)
---
TITLE: INTERN - PROBE EQUIPMENT
EMPLOYER: Micron Technology, Inc.
LOCATION: Fab 10N/X, Singapore (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-25
K401_MATCH: yes (not source-backed)
APPLY_URL: https://micron.wd1.myworkdayjobs.com/External/job/Fab-10NX-Singapore/INTERN---PROBE-EQUIPMENT_JR101153
EXCERPT: INTERN - PROBE EQUIPMENT Fab 10N/X, Singapore posted: Posted 18 Days Ago
---
TITLE: Senior Analog IP Integration, Power, and SI Engineer
EMPLOYER: Intel
LOCATION: 2 Locations (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-08
K401_MATCH: yes (not source-backed)
APPLY_URL: https://intel.wd1.myworkdayjobs.com/External/job/US-Arizona-Phoenix/Senior-Analog-IP-Integration--Power--and-SI-Engineer_JR0284626
EXCERPT: Senior Analog IP Integration, Power, and SI Engineer 2 Locations posted: Posted 4 Days Ago
---
TITLE: Principal Engineer - Go-To-Market
EMPLOYER: Intercom
LOCATION: London, England (unspecified)
SALARY: Not disclosed
POSTED: 2026-04-14
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/7811880
EXCERPT: Principal Engineer - Go-To-Market London, England Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? You will be responsible for architecting and delivering a high-scale, AI-native platform that transforms our Go-To-Market operations. By collaborating with data science, infrastructure, and GTM teams, you will execute a "build and buy" strategy to replace our legacy SaaS toolchains and manual heuristics with bespoke AI agents and automated workflows. This role demands a blend of technical leadership and operational rigor, transitioning incubated projects into production-ready solutions while maintaining excellence through robust monitoring, metrics, and support. Ultimately, you will build mission-critical tools that our top GTM
---
TITLE: Internship - Industrial Engineering
EMPLOYER: Infineon Technologies
LOCATION: Samut Prakan (Thailand) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808962167377
EXCERPT: Internship - Industrial Engineering Samut Prakan (Thailand)
---
TITLE: CNC Shift Programmer
EMPLOYER: Smiths Group
LOCATION: Suzhou, Jiangsu, China (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-10
APPLY_URL: https://jobs.smartrecruiters.com/SmithsGroup2/744000083601265-cnc-shift-programmer
EXCERPT: CNC Shift Programmer Suzhou, Jiangsu, China Company Description: Smiths Interconnect, is a global leader in the design and manufacture of high-performance interconnect solutions. Our products are used in mission-critical applications across industries such as aerospace, defense, telecommunications, and industrial markets. At Smiths Interconnect, we are committed to innovation, quality, and providing cutting-edge solutions that connect the world's most demanding systems. Smiths Interconnect is part of Smiths Group. For over 170 years, Smiths has been pioneering progress by engineering for a better future. We serve millions of people every year, to help create a safer, more efficient and productive, and better-connected world across four global markets: energy, security & defense, space & aerospace and general industrial. Listed on the London Stock Exchange, Smiths employs c.16,000 colleagues in over 50 countries. Job Description: Formulate program by the software Pro-M /master-cam 熟练运用Pro-M/Master CAM编制数控程序 Support the machine shop with the process and program issue支持MS解决工艺及程序问题 Make a backup for programming supervisor during programming supervisor absents. 有能力作为程编主管的后备力量 Follow and ownership for programming department guideline 遵循并负责编程部门流程 Monitor production processes and the effective use of manpower and equipment 监控MS生产工艺流程并有效利用MS人力和设备 DFM check, make judgment the manufacturing feasibility with detail design。 DFM检查， 对设计图纸的可加工性作出正确判断。 Good teamwork and willingness to accept more responsibilities良好的团队合作性，愿意接受更多的职责。 Support machine shop with different manufacture process in collaboration with PE or ME 对CNC加工以外的工艺，和PE/ME进行良好沟通合作 Implement Company Business Plan Objectives within programming team 执行编程部门内的公司商务计划目标 Implementing efficient, timely and cost-effective solutions to produce the manufacture of complex parts of various geometric dimensions requiring adherence to tight tolerances。实施高效、及时和经济有效的解决方案，以生产各种几何尺寸的复杂零件，需要严格遵守公差要求。 Any other tasks assigned
---
TITLE: Senior Data Scientist - AI Tooling
EMPLOYER: Intercom
LOCATION: Dublin, Ireland; London, England (unspecified)
SALARY: Not disclosed
POSTED: 2025-10-10
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/7314809
EXCERPT: Senior Data Scientist - AI Tooling Dublin, Ireland; London, England Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? The Research, Analytics & Data Science (RAD) team turns insight into action. We uncover customer, product, and business insights and translate them into tools and decision systems embedded directly into GTM workflows. AI has unlocked an entirely new generation of internal tools for our GTM teams. We're evolving from static dashboards to LLM and agent-powered workflows that do the work: auto-researching accounts, summarizing prior interactions, drafting personalized outreach, flagging renewal risk, and assembling decks and docs - enabling Sales and Success to
---
TITLE: Chip Design Verification Engineer
EMPLOYER: NVIDIA Corporation
LOCATION: Israel, Tel Aviv (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-20
K401_MATCH: yes (not source-backed)
APPLY_URL: https://nvidia.wd5.myworkdayjobs.com/NVIDIAExternalCareerSite/job/Israel-Tel-Aviv/Chip-Design-Verification-Engineer_JR2013845
EXCERPT: Chip Design Verification Engineer Israel, Tel Aviv posted: Posted 23 Days Ago
---
TITLE: DFT Intern - ASIC Student - Israel - ETR
EMPLOYER: Cisco
LOCATION: ISR-CAESAREA (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://cisco.wd5.myworkdayjobs.com/Cisco_Careers/job/ISR-CAESAREA/DFT-Intern---ASIC-Student---Israel---ETR_2010244
EXCERPT: DFT Intern - ASIC Student - Israel - ETR ISR-CAESAREA Please note this posting is to advertise potential job opportunities. This exact role may not be open today but could open in the near future. When you apply, a Cisco representative may contact you directly if a relevant position opens. Who We Are The Design for Test (DFT) team is part of the design group, which focuses on logic design, RTL development, and running verification tests. Their main role is to design test structures embedded within the chip to ensure proper functionality after manufacturing. The goal is to detect potential manufacturing defects with maximum efficiency and filter out faulty units before they reach the market. The ideal candidate is friendly, social, easygoing, with a good sense of humor, and has the ability to learn independently. They should be located in central\north Israel (Tel-Aviv\Caesarea). Strong independent work skills and job stability are important. What You'll Do Work in a small, agile team with an intimate atmosphere that offers direct mentoring and broad professional growth. Insert DFT logic, perform synthesis, and run Automatic Test Pattern Generation (ATPG) to ensure hardware testability. Execute Gate Level Simulations, timing checks, and DRC checks to maintain rigorous design integrity and performance standards. Run regressions and perform deep-dive debugging on simulation failures as part of the core verification process. Minimum Qualifications B.Sc or M.Sc Electrical/Computer Engineer student from leading Israeli Universities with average grades above 85. Team players who enjoy big challenges. People who can quickly ramp
---
TITLE: Global Supply Manager, Interconnects
EMPLOYER: Etched
LOCATION: San Jose, CA, United States (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-01
MENTAL_HEALTH_SUPPORT: yes (not source-backed)
APPLY_URL: https://jobs.ashbyhq.com/etched/b25223b5-441a-4c0a-a436-fc66063755c2
EXCERPT: Global Supply Manager, Interconnects San Jose, CA, United States About Etched Etched is building the world's first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history. Job Summary As Etched scales global deployments of our transformer inference systems, we are seeking an experienced Global Supply Manager to own sourcing and supplier strategy for high-speed interconnects, including cables, connectors, backplane interfaces, and optical/electrical data interconnect solutions. You will be responsible for building and managing Etched's global supply base for critical interconnect technologies that directly impact system bandwidth, latency, signal integrity, and reliability. This is a strategic and deeply cross-functional role working closely with Electrical Engineering, Systems, and Manufacturing to ensure scalable, high-performance interconnect solutions across rapidly growing deployments. Key responsibilities - Develop and execute sourcing strategies for high-speed interconnects, including copper and optical cables, connectors, backplane systems, and high-bandwidth data links - Build and manage relationships with interconnect, cable assembly, and connector suppliers across regions to ensure performance, quality, and scalability - Negotiate pricing, capacity, tooling, and long-term supply agreements for critical interconnect components and assemblies - Partner closely with Electrical and Systems Engineering on connector selection,
---
TITLE: Staff Design Verification Engineer – Coherent Interconnect
EMPLOYER: SiFive
LOCATION: 2 Locations (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-10
K401_MATCH: yes (not source-backed)
APPLY_URL: https://sifive.wd1.myworkdayjobs.com/sifivecareers/job/Boston-Massachusetts-United-States/Staff-Design-Verification-Engineer---Coherent-Interconnect_R-101212
EXCERPT: Staff Design Verification Engineer – Coherent Interconnect 2 Locations posted:
---
TITLE: IT Support Engineer
EMPLOYER: Eaton Corporation
LOCATION: Sincan Ankara, TUR, 06909 (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://eaton.eightfold.ai/careers/job/687236598823
EXCERPT: IT Support Engineer Sincan Ankara, TUR, 06909
---
TITLE: Analog Mixed -Signal IC Designer
EMPLOYER: Teledyne Technologies
LOCATION: Canada - Waterloo, ON (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://flir.wd1.myworkdayjobs.com/flircareers/job/Canada---Waterloo-ON/CMOS-Analog-Designer_REQ26880
EXCERPT: Analog Mixed -Signal IC Designer Canada - Waterloo, ON posted: Posted 30+ Days Ago
---
TITLE: Principal FPGA/ASIC Engineer - Level 3
EMPLOYER: Northrop Grumman Corporation
LOCATION: United States-Arizona-Gilbert (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://ngc.eightfold.ai/careers/job/1340071293927
EXCERPT: Principal FPGA/ASIC Engineer - Level 3 United States-Arizona-Gilbert
---
TITLE: Systemarchitekt - Schwerpunkt Hardware (m/w/d)
EMPLOYER: DXC Technology
LOCATION: DEU - WHV- WILHELMSHAVEN (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-26
K401_MATCH: yes (not source-backed)
APPLY_URL: https://dxctechnology.wd1.myworkdayjobs.com/DXCJobs/job/DEU---WHV--WILHELMSHAVEN/Systemarchitekt---Schwerpunkt-Hardware--m-w-d-_51569382
EXCERPT: Systemarchitekt - Schwerpunkt Hardware (m/w/d) DEU - WHV- WILHELMSHAVEN posted: Posted 17 Days Ago
---
TITLE: Solutions Engineer - LATAM (Portuguese Speaking)
EMPLOYER: Intercom
LOCATION: San Francisco, California (unspecified)
SALARY: $401K-$401K
POSTED: 2026-02-18
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/intercom/jobs/7624926
EXCERPT: Solutions Engineer - LATAM (Portuguese Speaking) San Francisco, California Fin is the AI Customer Agent company on a mission to help businesses provide perfect customer experiences. Our AI Agent Fin is the highest-performing AI Customer Agent on the market today, enabling businesses to deliver impeccable, always-on customer support across the customer journey - from service, to sales, to ecommerce. Powered by our own AI models, Fin resolves complex customer issues end-to-end across every channel, with minimal set-up and integration. Fin can also be combined with our natively integrated Intercom help desk for one single system that is designed to meet the needs of modern day support teams. Founded in 2011, Fin became one of the fastest growing companies and remains one of the largest private software companies in the world with nearly 30,000 global businesses using our products to transform their customer support. Driven by our core values, we push boundaries, build with speed and intensity, and relentlessly deliver incredible value to our customers. What's the opportunity? Fin is looking for an exceptional Solutions Engineer to join our vibrant Customer Solutions Team. In this role, you'll engage directly with our customers as their trusted advisor, playing a pivotal part in defining and demonstrating value across the entire sales cycle. With a natural curiosity, independent thinking, and strong problem-solving skills, you'll partner closely with Product, R&D, and Engineering to ensure our customers' needs and insights are at the core of our AI powered solutions. What will I be doing? - Lead
---
TITLE: Analog/mixed-signal IC Design Developer
EMPLOYER: ThousandEyes
LOCATION: Kanata, Ontario, Canada (unspecified)
SALARY: Not disclosed
POSTED: 2026-03-18
APPLY_URL: https://cisco.wd5.myworkdayjobs.com/Cisco_Careers/job/Kanata-Ontario-Canada/Analog-mixed-signal-IC-Design-Developer_2009010/apply
EXCERPT: Analog/mixed-signal IC Design Developer Kanata, Ontario, Canada Are you experienced in driving innovation in hardware engineering? Join our team as a Hardware Technical Leader, where you will lead cross-functional teams to develop next-generation hardware products while ensuring quality and performance standards are met.
---
TITLE: ASIC Layout Engineer - Analog, High speed IP - 8 to 11 years - Bangalore
EMPLOYER: ThousandEyes
LOCATION: Bangalore, India (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-14
APPLY_URL: https://cisco.wd5.myworkdayjobs.com/Cisco_Careers/job/Bangalore-India/ASIC-Layout-Engineer---Analog--High-speed-IP---8-to-11-years---Bangalore_2013032/apply
EXCERPT: ASIC Layout Engineer - Analog, High speed IP - 8 to 11 years - Bangalore Bangalore, India Embrace the role of an Asic Layout Engineer and lead the design and implementation of high-performance analog and mixed-signal circuits for next-generation optical interconnect solutions. Collaborate with multidisciplinary teams, drive layout innovation, and support advanced manufacturing processes in a dynamic, growth-focused environment. Shape the future of high-speed electronics with Cisco.
---
TITLE: Working Student - Circuit Simulation Development (f/m/div)
EMPLOYER: Infineon Technologies
LOCATION: Munich (Germany) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808971056332
EXCERPT: Working Student - Circuit Simulation Development (f/m/div) Munich (Germany)
---
TITLE: ASIC Engineer Internship (Armenia)
EMPLOYER: Cisco
LOCATION: Armenia (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://cisco.wd5.myworkdayjobs.com/Cisco_Careers/job/Armenia/ASIC-Engineer-Internship--Armenia-_2009839
EXCERPT: ASIC Engineer Internship (Armenia) Armenia Please note this posting is to advertise potential job opportunities. This exact role may not be open today but could open in the near future. When you apply, a Cisco representative may contact you directly if a relevant position opens. Meet the Team Join our specialized ASIC implementation team where we bridge the gap between architectural design and physical silicon reality. Our team provides a structured, mentorship-driven environment focused on block-level and top-level physical implementation, timing closure, and physical verification. We work at the heart of Cisco's hardware innovation, ensuring that our next-generation semiconductor technologies are reliable, efficient, and high-performing. You will collaborate with experienced engineers who are passionate about teaching and pushing the boundaries of VLSI technology. This is an exciting opportunity to gain hands-on experience with industry-standard tools while contributing to the hardware that powers the global internet. Your Impact Support physical design tasks including floorplanning, placement, and routing to ensure efficient ASIC implementation. Participate in Static Timing Analysis (STA) and timing closure activities to meet critical design performance specifications. Assist in IR Drop and EMIR analysis to maintain power integrity and long-term reliability of the hardware. Perform physical verification checks such as DRC and LVS to guarantee manufacturing readiness and design rule compliance. Prepare technical documentation and reports to communicate progress and findings to the broader engineering team. Minimum Qualifications • Currently enrolled in a Bachelor's or Master's program in Microelectronics, VLSI, Electrical Engineering, or a related field. • Strong academic foundation
---
TITLE: Hardware Engineer (eInfochips)
EMPLOYER: Arrow Financial CORP
LOCATION: US-MA-Bedford-Massachusetts (Werfen) (onsite)
SALARY: Not disclosed
POSTED: 2026-05-16
APPLY_URL: https://arrow.wd1.myworkdayjobs.com/AC/job/US-MA-Bedford-Massachusetts-Werfen/Hardware-Engineer_R238559
EXCERPT: Hardware Engineer (eInfochips) US-MA-Bedford-Massachusetts (Werfen) Position: Hardware Engineer (eInfochips) Job Description: Role: Hardware Engineer Location: Bedford, MA (Day-1 Onsite) What candidate will Be Doing: Experience on all stages of Hardware Product Development Lifecycle. Microcontroller: ST, Microchip, TI, based architecture design Analog and mixed signal design, ADC and DAC circuit design experience, Signal conditioning Operational amplifier, discrete component analog circuit design experience AC to DC and DC to DC power supply design Knowledge of interfaces like RS232, RS485, I2C, SPI, UART, Wi-Fi, BT, Zigbee would be plus. Electromagnetic Interference (EMI) / Electromagnetic compatibility (EMC) compliance for automotive products. Various tools like ORCAD, ALLEGRO, ALTIUM, PADS. Lab instruments like Multi- meters, Oscilloscope, Function Generator, Logic analyzer etc. What we are looking for: Responsible for the research, design, development and testing computer systems and components. Design new computer hardware, creating schematics of computer equipment to be built. Test the completed models of the computer hardware they design. Analyze the test results and modify the design as needed. Update existing computer equipment so that it will work with new software. Oversee the manufacturing process for computer hardware. Education: Bachelor's degree required Work Arrangement Fully Onsite: Must be able to travel to an Arrow Client office location as requested by Arrow Client leadership. Location: Bedford, MA (Day-1 Onsite) About eInfochips: eInfochips , an Arrow company (Fortune#154), is a leading global provider of product engineering and semiconductor design services. A rich history of over two decades, with over 500+ products developed and 40M deployments in 140
---
TITLE: Senior Chip Design Verification Engineer
EMPLOYER: NVIDIA Corporation
LOCATION: Israel, Tel Aviv (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://nvidia.wd5.myworkdayjobs.com/NVIDIAExternalCareerSite/job/Israel-Tel-Aviv/Senior-Chip-Design-Verification-Engineer_JR2017320
EXCERPT: Senior Chip Design Verification Engineer Israel, Tel Aviv posted: Posted 30+ Days Ago
---
TITLE: HR Intern
EMPLOYER: STMicroelectronics
LOCATION: Muar, Malaysia (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://stmicroelectronics.eightfold.ai/careers/job/563637170656396
EXCERPT: HR Intern Muar, Malaysia
---
TITLE: NPI Engineer, Chip
EMPLOYER: NVIDIA Corporation
LOCATION: Israel, Yokneam (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-01
K401_MATCH: yes (not source-backed)
APPLY_URL: https://nvidia.wd5.myworkdayjobs.com/NVIDIAExternalCareerSite/job/Israel-Yokneam/NPI-Engineer--Chip_JR2017732
EXCERPT: NPI Engineer, Chip Israel, Yokneam posted: Posted 11 Days Ago
---
TITLE: Hardware (PCBA) Design and Verification Intern
EMPLOYER: Ciena
LOCATION: Ottawa (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-25
K401_MATCH: yes (not source-backed)
APPLY_URL: https://ciena.wd5.myworkdayjobs.com/Careers/job/Ottawa/Hardware--PCBA--Design-and-Verification-Intern_R031027
EXCERPT: Hardware (PCBA) Design and Verification Intern Ottawa posted: Posted 18 Days Ago
---
TITLE: Internship - AI Agent Developer (f/m/div)
EMPLOYER: Infineon Technologies
LOCATION: Villach (Austria) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970870503
EXCERPT: Internship - AI Agent Developer (f/m/div) Villach (Austria)
---
TITLE: Application Engineer-Intern
EMPLOYER: Infineon Technologies
LOCATION: Shanghai | 上海 (China) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970905732
EXCERPT: Application Engineer-Intern Shanghai | 上海 (China)
---
TITLE: CAD Support Engineer for Semiconductor Design (Location: Tokyo)
EMPLOYER: Infineon Technologies
LOCATION: Tokyo (Japan) | Ho Chi Minh City (Vietnam) | Ho Chi Minh, Vietnam (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808961600030
EXCERPT: CAD Support Engineer for Semiconductor Design (Location: Tokyo) Tokyo (Japan) | Ho Chi Minh City (Vietnam) | Ho Chi Minh, Vietnam
---
TITLE: ASIC Package Engineer
EMPLOYER: ThousandEyes
LOCATION: Taipei, New Taipei, Taiwan (unspecified)
SALARY: Not disclosed
POSTED: 2026-04-30
APPLY_URL: https://cisco.wd5.myworkdayjobs.com/Cisco_Careers/job/Taipei-Taiwan/ASIC-Package-Engineer_2012558/apply
EXCERPT: ASIC Package Engineer Taipei, New Taipei, Taiwan Embrace the opportunity to become an ASIC Package Engineer and drive innovation in high-performance semiconductor packaging. Leverage your expertise in finite element analysis, thermomechanical simulation, and advanced packaging to support product design and reliability. Collaborate globally and make a direct impact on the future of Cisco systems. Grow your career with us!
---
TITLE: Hardware Engineer
EMPLOYER: SumUp
LOCATION: Berlin, Germany (unspecified)
SALARY: Not disclosed
POSTED: 2026-03-17
K401_MATCH: yes (not source-backed)
APPLY_URL: https://sumup.com/careers/positions/8458918002?gh_jid=8458918002
EXCERPT: Hardware Engineer Berlin, Germany About the role As a Hardware Engineer at SumUp, you'll play a key role in the early-stage development of our physical products. Working within the Hardware Tribe, you'll be responsible for translating product specifications into efficient, scalable electrical designs. In your daily work, you will design, review schematics and debug existing implementations. You will collaborate with mechanical engineers and other stakeholders to ensure quality, cost-effectiveness, and timely delivery. Your expertise will help accelerate product development and reduce risks in our growing portfolio. The role is based on-site in our office in Berlin. We believe in the power of face-to-face conversations that happen organically when working next to one another. What you'll do: - Design, review, and improve electrical schematics for new product development - Collaborate with our firmware and mechanical engineers to design, test and validate our products - Debug and validate designs through prototyping and iterative testing - Brainstorm as part of our passionate Hardware team to solve difficult problems and suggest design improvements - Act as an expert in the field of hardware engineering and coordinate the implementation in collaboration with agile, cross-functional teams within the framework of product development projects You'll be great for this position if: - 3-5 years of experience in electrical engineering, ideally in consumer electronics or hardware product development - Strong competence in at least a few of the following areas: RF (cellular, NFC, Wi-Fi/BT), power design, digital buses/protocols, battery technology, analog design - Proven experience bringing multiple hardware
---
TITLE: Hardware Engineer
EMPLOYER: Jbt Marel Corp
LOCATION: NL - Boxmeer JP (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
APPLY_URL: https://jbtm.wd108.myworkdayjobs.com/JBT_Marel_Career_Site/job/NL---Boxmeer-JP/Hardware-Engineer_21594-1
EXCERPT: Hardware Engineer NL - Boxmeer JP posted: Posted 30+ Days Ago
---
TITLE: Hardware Engineer (IoT)
EMPLOYER: Ubiquiti
LOCATION: Taipei (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-20
K401_MATCH: yes (not source-backed)
APPLY_URL: https://job-boards.greenhouse.io/ubiquiti/jobs/4253466009
EXCERPT: Hardware Engineer (IoT) Taipei About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you'll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Role Summary We are looking for a hands-on Senior Hardware Engineer to lead the design and mass production of our battery-powered IoT product lines. This role will drive board-level design, low-power optimization, and EMS/ODM coordination, partner with cross-functional teams on NPI and certification, and help bring our next generation of USL/UC products to market. Responsibilities (What he/she will do after joining UI) - Lead the hardware design of battery-powered portable products and IoT lighting / control devices from concept through mass production. - Define power architecture and conduct battery life estimation for primary lithium (CR series) and rechargeable Li-ion applications. - Drive low-power optimization through µA-level current measurement, sleep / wake-up strategy design, and power budget planning. - Design and review PMIC, charger IC, and battery protection circuits to ensure product safety and reliability. - Integrate wireless connectivity solutions (BLE, Zigbee, Wi-Fi, or Sub-GHz) into product designs, including
---
TITLE: Senior Process Technician
EMPLOYER: Smiths Group
LOCATION: Dundee, Scotland, United Kingdom (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-10
APPLY_URL: https://jobs.smartrecruiters.com/SmithsGroup2/744000113539995-senior-process-technician
EXCERPT: Senior Process Technician Dundee, Scotland, United Kingdom Company Description: Smiths Interconnect, is a global leader in the design and manufacture of high-performance interconnect solutions. Our products are used in mission-critical applications across industries such as aerospace, defense, telecommunications, and industrial markets. At Smiths Interconnect, we are committed to innovation, quality, and providing cutting-edge solutions that connect the world's most demanding systems. Smiths Interconnect is part of Smiths Group. For over 170 years, Smiths has been pioneering progress by engineering for a better future. We serve millions of people every year, to help create a safer, more efficient and productive, and better-connected world across four global markets: energy, security & defense, space & aerospace and general industrial. Listed on the London Stock Exchange, Smiths employs c.16,000 colleagues in over 50 countries. Job Description: Working with limited supervision to support all CAD to FAB R&D development projects for all product types including filters, circulators, isolators and couplers. Working with members of the design team process R&D RF wafers (thick film conductor and resistor deposition, firing, dicing and LASER ablation). Assembly of components such as circulators, isolators, filters (lumped element, SSS and cavity) and couplers. Support the test and qualification lab by performing dynamic and thermal qualification testing for internal and external customers. Provide immediate feedback to stakeholders when product fails or major issues encountered. This is a unique opportunity for an individual with experience in wafer processing and RF product evaluation, preferably with some RF test exposure, to work in an exciting
---
TITLE: Senior Principal Engineer Process Integration
EMPLOYER: Infineon Technologies
LOCATION: Melaka (Malaysia) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970791180
EXCERPT: Senior Principal Engineer Process Integration Melaka (Malaysia)
---
TITLE: FAE - Automotive Ethernet
EMPLOYER: Infineon Technologies
LOCATION: Shenzhen | 深圳 (China) | Shanghai | 上海 (China) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970565749
EXCERPT: FAE - Automotive Ethernet Shenzhen | 深圳 (China) | Shanghai | 上海 (China)
---
TITLE: System Hardware Engineer, Nitro team
EMPLOYER: Amazon
LOCATION: Haifa, Haifa, ISR (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-13
PARENTAL_LEAVE_WEEKS: 6 (not source-backed)
NON_BIRTH_PARENT_LEAVE_WEEKS: 6 (not source-backed)
K401_MATCH: yes (not source-backed)
FERTILITY_FAMILY_BUILDING_BENEFITS: yes (not source-backed)
ADOPTION_ASSISTANCE_OFFERED: yes (not source-backed)
MENTAL_HEALTH_SUPPORT: yes (not source-backed)
CHILDCARE_SUBSIDY: yes (not source-backed)
APPLY_URL: https://www.amazon.jobs/en/jobs/10418964/system-hardware-engineer-nitro-team
EXCERPT: System Hardware Engineer, Nitro team Haifa, Haifa, ISR Annapurna Labs seeks a System HW Engineer to define, shape, and integrate solutions for the next generation of our cloud platforms. As a System Engineer on the hardware team, you will define systems for Annapurna Labs' Network Interface Card (NIC) hardware, support the development and validation of our NIC, and help bring the NIC to mass production. You'll lead the implementation of new hardware interface technologies and scale them to large-scale deployment, continuously delivering a world-class customer experience. This fast-paced, intellectually challenging position requires collaboration with technical experts, senior leaders, and multiple technology teams. Key job responsibilities • Define and design systems to support K2 cards development and manufacturing. • Define and provide feedback to the design of the K2 Smart Network Interface Card. • Work with design partners and manufacturing sites, to enable healthy mass production of the K2 card. • Analyze and debug design/manufacturing/integration issues. • Continuously assess process capabilities and innovate to simplify processes, reduce costs, and shorten the time cycle of K2 cards' development and manufacturing. • Collaborate with members of cross-functional teams, to gain knowledge and improve product design, processes, and quality. • Work with customers, to optimize the entire value stream and put together joint processes that will lead to improved time cycle and lower costs. • Willing to travel abroad one or two times a year, for a week at a time. Basic Qualifications: - At least 5 years' experience leading hardware products from design
---
TITLE: Internship - Software Application Logistics
EMPLOYER: Infineon Technologies
LOCATION: Singapore (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808970664768
EXCERPT: Internship - Software Application Logistics Singapore
---
TITLE: FPGA Lead Designer
EMPLOYER: ON Semiconductor
LOCATION: Bangalore, Karnataka, India (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-25
APPLY_URL: https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/requisitions/job/2505569
EXCERPT: FPGA Lead Designer Bangalore, Karnataka, India FPGA Lead Designer
---
TITLE: Embedded Systems Engineer
EMPLOYER: Analog Devices
LOCATION: Ireland, Limerick (unspecified)
SALARY: Not disclosed
POSTED: 2026-05-12
PARENTAL_LEAVE_WEEKS: 6 (not source-backed)
NON_BIRTH_PARENT_LEAVE_WEEKS: 6 (not source-backed)
K401_MATCH: yes (not source-backed)
APPLY_URL: https://analogdevices.wd1.myworkdayjobs.com/External/job/Ireland-Limerick/Embedded-Systems-Engineer_R254526
EXCERPT: Embedded Systems Engineer Ireland, Limerick posted: Posted 30+ Days Ago
---
TITLE: Staff Engineer Package Development-Soldering_2725
EMPLOYER: Infineon Technologies
LOCATION: Wuxi | 无锡 (China) (unspecified)
SALARY: Not disclosed
POSTED: 2026-06-12
K401_MATCH: yes (not source-backed)
APPLY_URL: https://infineon.eightfold.ai/careers/job/563808971037471
EXCERPT: Staff Engineer Package Development-Soldering_2725 Wuxi | 无锡 (China)
---

[PASTE YOUR RESUME OR SKILLS HERE]