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Protara's portfolio includes its lead candidate, TARA-002, an investigational cell-based therapy in development for the treatment of non-muscle invasive bladder cancer (NMIBC) and lymphatic malformations (LMs). The Company is evaluating TARA-002 in an ongoing Phase 2 trial in NMIBC patients with carcinoma in situ (CIS) who are unresponsive or naïve to treatment with Bacillus Calmette-Guérin (BCG), as well as a Phase 2 trial in pediatric patients with LMs. Additionally, Protara is developing IV Choline Chloride, an investigational phospholipid substrate replacement for patients on parenteral support who are otherwise unable to meet their choline needs via oral or enteral routes. Protara was named one of the Best Places to Work by BioSpace, a leading industry news and job source. This honor demonstrates the company's desirability in the recruitment marketplace, looking at various merits with an emphasis on culture, career growth and development opportunities, leadership and innovation. 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In this role, you will focus on mechanical and thermomechanical simulations of ASICs and complex silicon packages. Your simulations will directly facilitate product design, ensure mechanical reliability, and accelerate time to market for high-performance Cisco systems. You will collaborate with a globally distributed team across multiple time zones, contributing to innovative, simulation-driven design across packaging, reliability, thermal, and hardware engineering groups. Your Impact · Perform finite element analysis to evaluate thermal mechanical stress, warpage, solder joint reliability of ASIC package, substrates, and advanced packaging assemblies. · Simulate and analyze linear/nonlinear material behaviors, such as plasticity, creep, and viscoelasticity, relevant to solder joints, Copper, stiffener, and underfills. · Develop and automate simulation workflows using Python, Fortran or similar scripting tools to streamline analysis and reporting. · Provide clear simulation results to support mechanical design, root cause analysis, and risk mitigation. · Support design optimization at early phase of product development and failure investigations by correlating FEA predictions with test data and field returns. · Document and present analysis results, assumptions, and design recommendations in a clear, structured format. Minimum Qualifications Bachelors + 7 years of related experience, or Masters + 4 years of related experience, or PhD + 1 years of related experience. At least 3 years of experience in mechanical design and thermomechanical simulation of semiconductor packages. 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